ToolKit MIL-217 Module

The MIL-HDBK-217 Module is a powerful reliability prediction program based on the internationally recognized method of calculating electronic equipment reliability given in MIL-HDBK-217 (published by the US Department of Defense). This standard uses a series of models for various categories of electronic, electrical and electro-mechanical components to predict failure rates which are affected by environmental conditions, quality levels, stress conditions and various other parameters. These models are fully detailed within MIL-HDBK-217.

MIL-HDBK-217

The MIL-HDBK-217 Module provides a user friendly interface to construct, analyze, and display system models. Building a hierarchy and adding new components could not be easier. The program calculates the failure rates associated with new components as they are added to the system, along with the overall system failure rate. Project data may be viewed both via grid view or dialog view simultaneously, allowing predictions to be performed with a minimum of effort.

Library management, import and export facilities are also provided. Quality user-configurable reports are produced by the program automatically. In addition, data is easily dropped into Microsoft® applications such as Word®, Excel®, Access®, etc. allowing a wide range of additional customized reports and charts to be produced.

Module features include:

Multiple systems within the same project
Transfer to and from any other module
Redundancy modeling including hot standby
External Arrhenius temperature model for user defined failure rates
Defense Microelectronics Activity (DMEA) parameters/analysis provided
Non-Operational period analysis included
Linked Blocks: represent blocks with identical characteristics
Features common to all modules

Special Topics

DMEA

As we know, MIL-HDBK-217 has not been updated for quite some time. However it is used frequently in certain industries as a method for predicting reliability. With new technologies and manufacturing processes, component reliability has improved but it has not been reflected in the standard. The end results are very conservative reliability values.

In a highly competitive bidding environment failure rate and mean time between failure values are a critical measure in contract awards. Companies have tried to come up with creative adjustments in their analyses to accurately reflect the expected product life. The Defense Microelectronics Activity (DMEA) was commissioned by the Office of the Secretary of Defense to reverse engineer components within MIL-HDBK-217 and then update the models.

To learn more of the collaboration between ITEM Software and the DMEA, click here.

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