DMEA
Updated MIL-HDBK-217 Component Models
As we know,
MIL-HDBK-217 has not been updated for quite some time. However it is used
frequently in certain industries as a method for predicting reliability.
With new technologies and manufacturing processes, component reliability
has improved but it has not been reflected in the standard. The end result
is very conservative reliability values.
In a highly
competitive bidding environment failure rate and mean time between failure
values are a critical measure in contract awards. Companies have tried
to come up with creative adjustments in their analyses to accurately reflect
the expected product life. The Defense Microelectronics Activity (DMEA)
was commissioned by the Office of the Secretary of Defense to reverse
engineer components within MIL-HDBK-217 and then update the models.
When the DMEA released Appendix B of the handbook, they collaborated with ITEM Software to incorporate Appendix B into ITEM ToolKit™.
As Dr. Gary Gaugler the Program Manager at the DMEA states, "We were searching
for an organization to publish and release these updated models to the
public. In an exclusive agreement with Item Software they incorporated
our work into their software tools to give their customers the latest
component technology in MIL-HDBK-217."
The detailed model allows the user to model with greater accuracy
VHSIC and VLSI/CMOS components within the MIL-HDBK-217F analysis. This
in turn leads to a more accurate Failure Rate and MTBF. The detail model
goes into greater depth in the physical side of the component and looks
into the following areas:
- Common Parameters,
- Oxide Defect,
- Metal Defect,
- Hot Carrier,
- Contamination,
- Package Type.
