MIL-HDBK-217 Software
ITEM ToolKit Module

MIL-HDBK-217F Notice 2 US Military Standard
Electronic Reliability Prediction

The MIL-HDBK-217 Module of ITEM ToolKit is a powerful reliability prediction program based on the internationally recognized method of calculating electronic equipment reliability defined in MIL- HDBK-217 (published by the US Department of Defense). This standard uses a series of models for various categories of electronic, electrical and electro-mechanical components to predict failure rates that are affected by environmental conditions, quality levels, stress conditions and various other parameters. These models are fully detailed within MIL-HDBK-217.

DMEA
Developed in collaboration with the Defense Micro-Electronic Activity (DMEA), the detail model allows the user to more accurately model the VHSIC, VLSI/CMOS component within the MIL-HDBK-217F analysis. This in turn leads to a more accurate Failure Rate and MTBF. The Detail Model goes into greater depth in the physical side of the component and looks into areas including: common; oxide; metal; hot carrier; contamination and package.

Non-Operating Periods on Equipment Reliability (NonOp)
The ITEM ToolKit MIL-HDBK-217 module also supports the calculation of the MTBF and Failure Rate of equipment during non-operational periods. Based upon the RADC-TR-85-91 standard, this built-in calculation allows you to further refine your analysis.

Custom Connections
The MIL-HDBK-217 standard is limited as to the types of connection technologies it supports. ITEM has added the ability for you to define custom connection technologies and their failure rates for use in the analysis. Any connection technology, such as sonic welding or gold-to-gold solder, with a known failure rate can be used.

The MIL-HDBK-217 module provides a user friendly interface which allows the user to construct, analyse and display, system models using interactive facilities. Building a hierarchy and adding new components could not be easier. The program calculates the failure rates, including Mean Time Between Failure ( MTBF ), associated with new components as they are added to the system, along with the overall system failure rate. Project data may be viewed both via grid view or dialog view simultaneously, allowing predictions to be performed with a minimum of effort.

Library management, import and export facilities are also provided. Quality user-configurable reports are produced by the program automatically. In addition, data may simply be dragged and dropped into Microsoft® applications such as Word®, Excel®, Access® etc. allowing a wide range of additional customised reports and charts to be produced.

Features include:

  • Multi Systems within the same project
  • Transfer to and from any other module
  • Redundancy modeling including hot standby
  • Mission Phase
  • External Arrhenius temperature model for user defined failure rates
  • Linked Blocks, represent blocks with identical characteristics

Reliability Predicition | IEC 62380

Download Demonstration

To download a free demonstration of our MIL-HDBK-217 software click here.

Screen shots | click to enlarge

MIL-HDBK-217 Screen Shot
Dialog view

MIL-HDBK-217 Screen Shot
Chart view

MIL-HDBK-217 Screen Shot
Grid view

 

Features

Powerful and user friendly MIL-HDBK-217 electronic reliability prediction software

Combine prediction methods for complex analysis

Build and open multiple systems and project files

Drag and drop components and systems between projects

Powerful charting facilities

User defined custom library facilities

Import and export to MS Excel, Access and Word etc.

Advanced hybrid linking and modeling

Multi Systems within the same project

Transfer to and from any other module

Redundancy modelling including hot standby

External Arrhenius temperature model for user defined failure rates

Linked Blocks, represent blocks with identical characteristics